Abstract: Due to the complex processing technology and poor heat transfer performance of the cold plate of metal flow channels, a processing method was proposed for cold plate of metal flow channels based on carbon nanospheres masking process. And a cold plate of metal flow channels was manufactured for a certain type of high-power T/R module. Some numerical simulation and experiments were carried out to study the flow characteristics and heat transfer performance of cold plate of metal flow channels. Results show that, when the heat dissipation of the T/R module is at 500 W and the flow rate is at 3.5 L/min, the simulated and measured results of the highest case temperature of the power amplifier device are 38.7℃ and 43.7℃ respectively. The new processing technology is simple and easy to implement, can provide better flow characteristics and heat transfer performance, that can meet the heat dissipation requirements of various high-power electronic components/modules.