Abstract: RF-MEMS technique, which combines MEMS fabrication technologies and microwave theories, provides a new solution for the development of key components of millimeter-wave radar and advanced communication systems to be much smaller and higher density integrated. In order to optimize the gold layer deposition technique for the silicon-based RF-MEMS band-pass filter fabrication, a pulse plating technique was proposed based on the environment friendly non-cyanide sulfite gold salts solutions. By optimizing key process parameters including current density, duty ratio, positive and negative pulse time ratio, pulse frequency, temperature and stirring speed, the optimized electroplating parameters were obtained and were successfully applied to the fabrication of silicon-based dual-layer self-shielded RF-MEMS band-pass filters. The study provides a fundamental guidance to the fabrication of RF-MEMS correlation devices.