ε-HNIW/F2311 PBX界面结构力学行为模拟

Simulation on the Mechanical Behavior of the Interface Structure in ε-HNIW/F2311 PBX

  • 摘要: 研究了ε-六硝基六氮杂异伍兹烷(ε-HNIW)/F2311界面结构的力学行为. 采用分子动力学(MD)方法,在298~423 K 温度范围内以及NVT系综和COMPASS力场下,对F2311与ε-HNIW (110)晶面所构成PBX界面结构的各种力学性能进行模拟计算. 结果表明,温度达到348 K后,ε-HNIW/F2311界面结构比内层ε-HNIW形状变化(G)和体积变化(K)都变得相对容易,弹性增强的同时可以有效地分散应力,有利于PBX的加工;进一步分析K/G表明,ε-HNIW/F2311界面结构在298~373 K内成型性较好,尤其在348 K左右时最适合进行PBX的压制成型.

     

    Abstract: The mechanical behavior of 2,4,6,8,10,12-hexanitro-2,4,6,8,10,12-hexaazaisowurtzitane (ε-HNIW)/F2311 interface structure was investigated in this paper. Molecular dynamics (MD) simulation was applied to calculate the mechanical properties of the PBX interface structure comprised of the polymer F2311 and ε-HNIW (110) crystal, at 298~423 K in NVT ensemble using the COMPASS force-field. The results show that the shape (G) and volume (K) of interface structure have better flexibility compared with those of inner structure in ε-HNIW/F2311 when the temperature reached 348 K, revealing that the forced stress could be effectively dispersed simultaneously when the elasticity of system become stronger, which is in favor of the PBX processing. Further analysis of K/G indicates that ε-HNIW/F2311 interface structure has a better mouldability at 298~373 K, especially at 348 K which is the most suitable temperature for the compression moulding of PBX.

     

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